BrikoX@lemmy.zipM to Hardware@programming.devEnglish · 5 days agoBroadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM moduleswww.tomshardware.comexternal-linkmessage-square0fedilinkarrow-up14file-text
arrow-up14external-linkBroadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM moduleswww.tomshardware.comBrikoX@lemmy.zipM to Hardware@programming.devEnglish · 5 days agomessage-square0fedilinkfile-text